Innovation in integrated circuit design and manufacturing is constantly pushing the limits for smaller device architectures with higher performance. The modern microchip is more energy-efficient for powering smart electronic devices. With shrinking geometries, especially in the FinFET and stacked-die architectures, design challenges related to power and reliability become crucial. AlphaEDA Technology addresses mobile semiconductor simulation and modeling tools that offer sign-off accuracy and performance needed to ensure the power, noise iand reliability of complex ICs, taking into account thermal effects and electrostatic discharge phenomena.

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